The development of the ISL8201M, a highly-integrated new POWER conversion module that saves space and cost has been announced by Intersil.The ISL8201M is a high-EFFICIENCY low-noise, highly-integrated DC-DC power solution in a thermally enhanced QFN package. Included in the package are the PWM controller, MOSFET drivers, power MOSFETs and inductor along with an optimized compensation circuit.
The device simplifies power supply design as only input and output capacitors and a RESISTOR are needed to implement a complete power solution. This small form factor saves considerable board space while the high integration reduces procurement and placement costs in various applications such as telecommunication, data communication, electronic data processing, WIRELESS network systems, medical and instrumentation, and distributed bus architecture based point of load applications. Also, an onboard input filter supports an ultra-low noise operation thus reducing EMI.
The ISL8201M achieves up to 93percent efficiency and 'excellent' thermal performance due to the QFN package that is designed to offer an optimum heat transfer through the PCB. A copper plate under the package allows the ISL8201M to achieve a power density of approximately 200W/in3, roughly four times that of conventional open-frame modules thereby eliminating the need for heat sinks. Other features include internal soft-start, auto-recovery over-current protection, ENABLE pin option and pre-biased output start-up capability.
The ISL8201M's tiny QFM package measures just 15mm x 15mm x 2.5mm, says the company.
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