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Showing posts with label AVX. Show all posts
Showing posts with label AVX. Show all posts

10 January 2009

2200µF tantalums in low-profile package

AVX - Low-profile 2200µF tantalums in low-profile packageA new high capacity PulseCap tantalum capacitor in a low profile package, was introduced by AVX. The capacitors are designed for applications such as PCMCIA / Wireless USB cards express bulk capacity is needed for power of the issuer.

The large case tantalum products listed at 2200F (2.2mF) / 6.3V. A maximum of 2 mm height of the cases makes them ideal for smaller applications. The extinction undertab style, where the "J" are replaced by the excellent dismissal led outside the perimeter of the case, the increase in volumetric EFFICIENCY parties and can be placed on the foot, so important economies of the area.

PulseCap devices are RoHS compliant and can meet up to 3x reflow soldering profile 260C. Operating temperature range is-55c to 125 C. Other applications include wireless data cards sensors and counting, says the company.

"Our new capacitors PulseCap devices complement our BestCap low ESR. Unlike other cases of large size, high capacity devices, where his Pulse Caps surface mount devices are lead-free reflow assembly process. They also have more space on a PCB and offer excellent robustness thrust, "said Thomas Zednicek, technical marketing, AVX.

14 December 2008

AVX - High capacitance tantalums save up to 60 percent board space

AVX - High capacitance tantalums save up to 60 percent board spaceA new termination style for MnO2 (TLN Series) and polymer (TCN Series) tantalum capacitors has been announced by AVX. It reduces the required internal construction space by up to 60 percent and enables parts to be positioned very closely together, says the company.

In the new configuration, ‘J’ leads are replaced by ‘undertab’ terminations that do not protrude outside of the outline of the case. This design not only increases volumetric EFFICIENCY, but also allows printed circuit board (PCB) footprint pads to be spaced only slightly wider than the part itself.

This package construction features a second electrode, which results in a lower self inductance (ESL), enabling a better working frequency range. Ignition resistance is also significantly improved with polymer TCN Series version.

The new undertab termination design significantly reduces the footprint on the PCB, while increasing performing characteristics. The reduction in size and space makes the TLN and TCN Series tantalum capacitors ideal for any application that requires component miniaturization.

Available in low-profile packaging, the smallest devices measure just 1mm in height. The planned capacitance range is 22 - 680µF (+/- 20%), and working voltage range 4-10V. The first devices available are the TLN S case (1206, 1.2mm max height) 220µF 4V product, and TCN L case (1210 1mm max height) 150µF 6.3V capacitor. Devices are suitable for 3 x 260C reflow solder processing.

The capacitors are designed for use in any application that requires high capacitance in a miniature package, particularly consumer products such as handheld devices, mobile phones and MP3 players, as well as suit POWER line and audio circuit designs.