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08 December 2008

Farnell - Design engineers offered latest high-speed connectivity solutions

Farnell - Design engineers offered latest high-speed connectivity solutionsA new global franchise agreement has been signed by Samtec and Premier Farnell. Premier Farnell will stock Samtec’s industry-leading range of high-speed connectivity solutions, and distribute them through its global network of companies – Newark in the Americas, Farnell in Europe, Australia, New Zealand and India, Premier Electronics in China, Hong Kong and Taiwan, and Farnell-Newark in ASEAN and Brazil. The Samtec product offering to be actively marketed and stocked across the world, will include signal integrity systems, rugged systems including power-to-board, sealed circular and rugged / high shock and vibration systems, and micro systems with flexible board stacking from 0.5mm pitch to 200-inches and above. The new global agreement will provide designers immediate web access to data and support, as well as reduced delivery lead times, says the company. “The new global franchise agreement with Samtec will fortify our high-speed connectivity solutions for our world-wide design engineering customer base,” said Marianne Culver, head of global supplier management, at Premier Farnell. “We are remarkably pleased to be working with an industry-leading organisation that has ranked number one in The Bishop Report’s for ‘Customer Survey of the Electronics Industry’ for over a decade.” Scott Lamb, Samtec's global distribution manager: “We are excited about our new relationship with Premier Farnell. "Premier Farnell’s global reach and dedication to the engineering and design segments for the electronics market are a great fit with Samtec’s product offering."

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