AVX - High capacitance tantalums save up to 60 percent board space

A new termination style for MnO2 (TLN Series) and polymer (TCN Series) tantalum capacitors has been announced by AVX. It reduces the required internal construction space by up to 60 percent and enables parts to be positioned very closely together, says the company.

In the new configuration, ‘J’ leads are replaced by ‘undertab’ terminations that do not protrude outside of the outline of the case. This design not only increases volumetric EFFICIENCY, but also allows printed circuit board (PCB) footprint pads to be spaced only slightly wider than the part itself.

This package construction features a second electrode, which results in a lower self inductance (ESL), enabling a better working frequency range. Ignition resistance is also significantly improved with polymer TCN Series version.

The new undertab termination design significantly reduces the footprint on the PCB, while increasing performing characteristics. The reduction in size and space makes the TLN and TCN Series tantalum capacitors ideal for any application that requires component miniaturization.

Available in low-profile packaging, the smallest devices measure just 1mm in height. The planned capacitance range is 22 - 680µF (+/- 20%), and working voltage range 4-10V. The first devices available are the TLN S case (1206, 1.2mm max height) 220µF 4V product, and TCN L case (1210 1mm max height) 150µF 6.3V capacitor. Devices are suitable for 3 x 260C reflow solder processing.

The capacitors are designed for use in any application that requires high capacitance in a miniature package, particularly consumer products such as handheld devices, mobile phones and MP3 players, as well as suit POWER line and audio circuit designs.